Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Outside periphery of package having specified shape or...
Reexamination Certificate
2005-02-08
2005-02-08
Parekh, Nitin (Department: 2811)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
Outside periphery of package having specified shape or...
C257S690000, C257S692000, C257S693000, C257S783000, C257S784000, C257S701000, C257S724000, C257S697000, C257S737000, C257S789000
Reexamination Certificate
active
06853074
ABSTRACT:
A surface of an external electrode3of an electronic part4is formed with a coating containing resin ingredient. Thereby, adhesion strength and reliability may be significantly improved in mounting an electronic part onto a circuit board1through the medium of a conductive adhesive. Further, it will be able to mount an electronic part to an element to be mounted by utilizing a conductive adhesive forming an external electrode3as a connecting element.Further, surface roughness (Ra) of an external electrode3of an electronic part is set to 0.1 μm or more and to 10.0 μm or less and preferably to 1.0 μm or more and to 5.0 μm or less. Thereby, adhesion strength with a conductive adhesive may be significantly enhanced in comparison with a conventional electronic part presented.
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Ishimaru Yukihiro
Kitae Takashi
Mitani Tsutomu
Takezawa Hiroaki
Matsushita Electric - Industrial Co., Ltd.
McDermott Will & Emery LLP
Parekh Nitin
LandOfFree
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