Electronic packaging with varying height connectors

Details Electronic packaging with varying height connectors Electronic packaging with varying height connectors

1992-12-17

1993-11-30

Hearn, Brian E.

Fishing, trapping, and vermin destroying

437184, 437209, 437217, 437220, H01L 2144

Patent

active

052665208

ABSTRACT:
In joining conductors at different levels on a carrier to contact locations on a planar substrate, mound shaped connections are employed, with the height of each mound shaped connection extending to the level of the particular conductor to which it is bonded. The mound shaped connections are formed using planar processes of controlled volume deposition, surface tension shaping on reflow, and physical deformation. The height of the mound shaped connections are calculated empirically from the volume deposited bounded by the substrate pad after surface tension limits the slump on reflowing.

REFERENCES:
patent: 3458925 (1969-08-01), Napier et al.
patent: 3871015 (1975-03-01), Lin et al.
patent: 4545610 (1985-10-01), Lakritz et al.
patent: 4912547 (1990-03-01), Bilowith et al.
patent: 4948754 (1990-08-01), Kondo et al.
patent: 4999700 (1991-03-01), Dunaway et al.
patent: 5039628 (1991-08-01), Carey
patent: 5126818 (1992-06-01), Takam et al.
IBM Technical Disclosure Bulletin vol. 22 No. 7 Nov. 1979 pp. 2734-2735 "Double Mask System for Solder Bump Formation" by P. A. Totta.
IBM Technical Disclosure Bulletin vol. 20 No. 4 Sep. 1977 p. 1894 "Dummy Pads for Increased Creep Resistance" by Herdzk et al.

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