Electronic packaging technique to improve sensor failure...

Details Electronic packaging technique to improve sensor failure... Electronic packaging technique to improve sensor failure...

2009-08-31

2011-10-18

Yun, Jurie (Department: 2882)

X-ray or gamma ray systems or devices

Specific application

Computerized tomography

Reexamination Certificate

active

08041003

ABSTRACT:
A modular sensor assembly comprises: sensor arrays electrically coupled to a sensor substrate; a plurality of integrated circuits with sensor signal processors electrically coupled to a package substrate; and an interconnect assembly including electrical paths configured to electrically couple analog output signals from a first sensor array to a first integrated circuit and from a second sensor to a second integrated circuit, the first sensor disposed adjacent to the second sensor.

REFERENCES:
patent: 6995581 (2006-02-01), Barr et al.
patent: 7286068 (2007-10-01), Stanley et al.
patent: 7289336 (2007-10-01), Burdick, Jr. et al.
patent: 7362250 (2008-04-01), Weibiao et al.
patent: 7433192 (2008-10-01), Bambridge et al.
patent: 7451651 (2008-11-01), Woychik et al.

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