Electronic packaging of components incorporating a ceramic-glass

Stock material or miscellaneous articles – Sheet including cover or casing – Complete cover or casing

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428209, 428210, 428323, 428328, 428325, 428329, 428330, 428331, 428428, 428432, 428433, 428704, 428901, 428212, 428698, 501 32, 501 76, 357 72, 357 78, 357 81, 174 685, B32B 104, H01L 2328

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048822124

ABSTRACT:
The present invention is directed to components and the process of forming the components for housing semiconductor devices. The components are formed of a unique ceramic-glass-metal composite material comprising ceramic particles, metallic particles and a glass matrix with said ceramic and metallic particles dispersed throughout. Metal elements can be embedded into the material to enable simplified fabrication of devices such as semiconductor packaging.

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