Electronic packaging and method of making the same

Details Electronic packaging and method of making the same Electronic packaging and method of making the same

2007-10-30

2007-10-30

Reichard, Dean A. (Department: 2841)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

C361S749000, C257S428000

Reexamination Certificate

active

10975952

ABSTRACT:
An interconnect structure for use in an electronic device, wherein the interconnect structure comprises a first substrate comprising a flexible material, wherein the first substrate comprises a front side and a back side, and wherein the first substrate is configured to receive a sensor on the front side; and a second substrate coupled to the back side of the first substrate and comprising a rigid material. A detector module for use in an imaging system comprises the aforementioned interconnect structure.

REFERENCES:
patent: 4617730 (1986-10-01), Geldermans et al.
patent: 4783695 (1988-11-01), Eichelberger et al.
patent: 4933042 (1990-06-01), Eichelberger et al.
patent: 6242282 (2001-06-01), Fillion et al.
patent: 6940141 (2005-09-01), Kinsman
patent: 2005/0167606 (2005-08-01), Harrison et al.

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