Electronic packaging and cooling system using superconductors fo

Details Electronic packaging and cooling system using superconductors fo Electronic packaging and cooling system using superconductors fo

1990-11-09

1993-05-18

Tolin, Gerald P.

Electricity: electrical systems and devices

Electrostatic capacitors

Fixed capacitor

622592, 174 154, 361382, 505 1, 505700, 257716, H05K 720

Patent

active

052126269

ABSTRACT:
A board containing plural superconducting power planes, one for each required potential level, is used to distribute power to one or more semiconductor logic chips which, together with the board, are immersed in liquid nitrogen. Each chip is coupled thermally to a heat exchanger and is coupled electrically to the board through leads that minimize heat transfer from the chip to the board.

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IBM Technical Disclosure Bulletin, vol. 20, No. 9, Feb. 1978, pp. 3452-3453, "Semiconductor Package with Improved Cooling".
IBM Technical Disclosure Bulletin, vol. 18, No. 4, Sep. 1975, pp. 1226-1229 by V. L. Rideout.

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