Electronic packages and method to enhance the passive thermal ma

Details Electronic packages and method to enhance the passive thermal ma Electronic packages and method to enhance the passive thermal ma

1997-09-03

1999-06-15

Picard, Leo P.

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

361697, 361704, 361709, 361710, 174 151, 174 161, 174 524, 174 35R, 165 802, 165 803, 165185, H05K 720

Patent

active

059128003

ABSTRACT:
A method of enhancing the passive thermal management of electronic packages, and an electronic package consisting of a vertically-oriented substrate, such as a printed circuit board or the like, a heat-generating electronic module, for example, containing at least one chip which is positioned on a substrate, and a cover plate located adjacent to the module at a predetermined spaced relationship therefrom. The cover plate includes at least one opening located adjacent the module at a predetermined location relative thereto so as to ensure a maximum cooling air flow impinging on the module, and which air flow thereafter passes upwardly between the substrate and the cover plate. The cover plate may be equipped with a heat-sink structure, such as fins, for cooling the module, which structure is adapted to project through the opening formed in the cover plate or to lie flush therewith.

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