Electronic packages and components thereof formed by...

Details Electronic packages and components thereof formed by... Electronic packages and components thereof formed by...

2008-05-13

2008-05-13

Norris, Jerry C. (Department: 2841)

Electricity: conductors and insulators

Conduits, cables or conductors

Preformed panel circuit arrangement

C174S268000, C361S767000, C029S825000

Reexamination Certificate

active

07371975

ABSTRACT:
A package includes at least one electronic component mounted on a substrate formed through imprinting. In an embodiment, the substrate may comprise conductive traces, vias, and patterns of lands on one or more layers. Conductor features of different geometries may be formed by imprinting them simultaneously on one or both surfaces of an imprintable tape. Fabrication apparatus and methods, as well as application of the imprinted package to an electronic assembly, are also described.

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