Electronic packages and a method to improve thermal performance

Details Electronic packages and a method to improve thermal performance Electronic packages and a method to improve thermal performance

1997-09-03

1999-10-12

Thompson, Gregory

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

174 163, 257719, 361710, 361715, H05H 720

Patent

active

059662905

ABSTRACT:
An electronic package incorporating a heat-generating element which is thermally coupled to a heat-sinking member, through the utilization of a predetermined thermally conductive material, and wherein all of these components are placed in compression during package operation so as to resultingly improve the thermal performance of the electronic package. A method is set forth of improving the thermal performance of an electronic package through the intermediary of compressive forces being generated between the package components during package operation.

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