Electronic package with optimized lamination process

Details Electronic package with optimized lamination process Electronic package with optimized lamination process

2006-06-13

2006-06-13

Chang, Rick Kiltae (Department: 3729)

Metal working

Method of mechanical manufacture

Electrical device making

C029S846000, C029S830000, C029S831000, C029S832000, C361S795000, C361S792000, C361S793000, C361S794000, C361S748000, C174S255000, C174S266000, C174S262000, C257S700000, C257S698000, C438S125000

Reexamination Certificate

active

07059049

ABSTRACT:
An electronic package and method of formation. A thermally conductive layer having first and second opposing surfaces is provided. A first dielectric layer is laminated under pressurization to the first opposing surface of the thermally conductive layer, at a temperature between a minimum temperature T1MINand a maximum temperature T1MAX. T1MAXconstrains the ductility of the first dielectric layer to be at least D1following the laminating. T1MAXdepends on D1and on a first dielectric material comprised by the first dielectric layer. A second dielectric layer is laminated under pressurization to the second opposing surface of the thermally conductive layer, at a temperature between a minimum temperature T2MINand a maximum temperature T2MAX. T2MAXconstrains the ductility of the second dielectric layer to be at least D2following the laminating. T2MAXdepends on D2and on a second dielectric material comprised by the second dielectric layer.

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