Electronic package with lead wire connections and method of maki

Details Electronic package with lead wire connections and method of maki Electronic package with lead wire connections and method of maki

1995-04-21

1995-11-28

Picardat, Kevin M.

Fishing, trapping, and vermin destroying

437211, 437214, 437217, 437219, 437220, H01L 2160

Patent

active

054707960

ABSTRACT:
An electronic package assembly wherein lead wires serve to connect conductors on a first substrate (e.g., ceramic) having a semiconductor device (e.g., IC chip) coupled to the conductors and positioned on the substrate, to respective conductors on a second substrate (e.g., a printed circuit board). The lead wires are secured to three different surfaces (e.g., top, side and bottom) of the first substrate, and include curved projection portions for being directly connected to the second substrate conductors.

REFERENCES:
patent: 4689875 (1987-09-01), Solstad
patent: 5198391 (1993-03-01), Rosel et al.
patent: 5219795 (1993-06-01), Kumai et al.
patent: 5286680 (1994-02-01), Cain
patent: 5304843 (1994-04-01), Takubo et al.
patent: 5355580 (1994-10-01), Tsukada
patent: 5375320 (1994-12-01), Kinsman et al.
patent: 5378657 (1995-01-01), Lin
patent: 5390082 (1995-02-01), Chase et al.

Affiliated with

Also associated with

Rating

Electronic package with lead wire connections and method of maki does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Electronic package with lead wire connections and method of maki, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Electronic package with lead wire connections and method of maki will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-2013406