Electronic package with integral electromagnetic radiation...

Details Electronic package with integral electromagnetic radiation... Electronic package with integral electromagnetic radiation...

2005-12-22

2009-12-01

Mandala, Victor A (Department: 2826)

Active solid-state devices (e.g., transistors, solid-state diode

With shielding

With means to shield device contained in housing or package...

C257S659000, C257SE23114, C257SE23115, C438S064000

Reexamination Certificate

active

07626247

ABSTRACT:
A method and system for fabricating an electromagnetic radiation shield for an electronics package is disclosed. The electronics package includes a substrate, at least one ground contact feature, and a protective layer. The electronics package is physically coupled to at least one additional electronics package through at least the substrate. The method and system include exposing a portion of the ground contact feature(s) by removing a portion of the electronics package above the ground contact feature(s). The exposing step forms at least one trench above the ground contact feature(s). The method and system also include depositing an electromagnetic radiation shield that substantially covers the electronics package, fills the trench(es), and is electrically connected to the ground contact feature(s). The method and system also include separating the electronics package from the additional electronics package(s) such that a remaining portion of the electromagnetic radiation shield that substantially encloses a portion of the electronics package above the ground contact feature(s) remains.

REFERENCES:
patent: 6424024 (2002-07-01), Shih et al.
patent: 6812566 (2004-11-01), Rabadam et al.
patent: 6903304 (2005-06-01), McLellan et al.
patent: 6905891 (2005-06-01), Kovar et al.
patent: 2006/0145361 (2006-07-01), Yang et al.
patent: WO-2007/076022 (2007-07-01), None
patent: WO-2007076022 (2007-07-01), None

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