Electronic package with improved heat sink

Details Electronic package with improved heat sink Electronic package with improved heat sink

1988-07-13

1989-07-18

Thompson, Gregory D.

Electricity: electrical systems and devices

Electrostatic capacitors

Fixed capacitor

174 163, 165 803, 165185, 357 81, H05T 720

Patent

active

048498564

ABSTRACT:
An electronic package including a first substrate (e.g., printed circuit board), a semiconductor device (e.g., silicon chip), a second circuitized substrate (e.g. polyimide having chrome-copper chrome circuitry thereon) and a heat sink (e.g., extruded aluminum or copper). The heat sink includes pliant members (e.g., pliable leg members) secured thereto or forming part thereof such that the heat sink can be downwardly depressed a predetermined distance to effect contact with the semiconductor device without causing damage thereto. Such downward depression facilitates assembly of the package.

REFERENCES:
patent: 3670215 (1972-06-01), Wilkens et al.
patent: 4004195 (1977-01-01), Harayda et al.
patent: 4012768 (1977-03-01), Kirk et al.
patent: 4066839 (1978-01-01), Cossuta et al.
patent: 4415025 (1983-11-01), Horvath
patent: 4593342 (1986-06-01), Lindsay
patent: 4605058 (1986-08-01), Wilens
patent: 4658331 (1987-04-01), Berg
patent: 4750089 (1988-06-01), Derryberry et al.

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