Electronic package with heat spreader member

Details Electronic package with heat spreader member Electronic package with heat spreader member

1988-07-13

1990-04-03

Pellinen, A. D.

Electricity: electrical systems and devices

Electrostatic capacitors

Fixed capacitor

361386, 357 81, H02B 100

Patent

active

049145517

ABSTRACT:
An electronic package (10) including a first circuitized substrate 11 (e.g., printed circuit board) having connected thereto a second, flexible circuitized substrate (e.g., polyimide with chrome-copper-chrome circuitry thereon). The second substrate is in turn electrically connected to the invention's semiconductor device (e.g., silicon chip), which device in turn is attached to a heat spreader (37) for providing effective heat transference from the device to the package's heat sink (33). The heat sink is attached to the first substrate (e.g., using solder). Significantly, the coefficients of thermal expansion of the heat spreader, semiconductor device and adhesive used to connect same are substantially similar, around 2 to 5 ppm/degree Kelvin (.times.10.sup.-6 m/m degrees Kelvin), in order to provide an effective heat path from the heat-generating device to the corresponding, much larger heat sink.

REFERENCES:
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IBM TDB, vol. 19, No. 9 (2/77), p. 3321--"Modular Organic Carrier", (N. C. Arvanitakis).
IBM TDB, vol. 20, No. 4 (9/77), p. 1433--"Controlled Gap in Semiconductor Packages", (V. Y. Doo et al.).
IBM TDB, vol. 20, No. 4 (9/77), pp. 1438, 1439--"High Performance Single Chip Module" (V. Y. Doo et al.)
IBM TDB, vol. 21, No. 1 (6/78), pp. 99, 100--"Circuit Chip Support Assembly with Fatigue-Resistance Epoxy Bond" (V. D. Coombs et al).
IBM TDB, vol. 24, No. 1A (6/81), p. 14--"Heat Spreader with Thermal Grease", (W. A. Camp et al).
IBM TDB, vol. 27, No. 11 (4/85), p. 6382--"Copper-Clad Invar Heatsink".

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