Electronic package with direct cooling of active electronic...

Details Electronic package with direct cooling of active electronic... Electronic package with direct cooling of active electronic...

2006-06-20

2006-06-20

Datskovskly, Michael V. (Department: 2835)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

C361S689000, C361S698000, C361S699000, C165S104330, C062S259200

Reexamination Certificate

active

07064953

ABSTRACT:
A cooling assembly includes a package with one or more dies cooled by direct cooling. The cooled package includes one or more dies with active electronic components. A coolant port allows a coolant to enter the package and directly cool the active electronic components of the dies.

REFERENCES:
patent: 4000509 (1976-12-01), Jarvela
patent: 4245273 (1981-01-01), Feinberg et al.
patent: 4561040 (1985-12-01), Eastman et al.
patent: 4757255 (1988-07-01), Margozzi
patent: 4778326 (1988-10-01), Althouse et al.
patent: 4820976 (1989-04-01), Brown
patent: 4839774 (1989-06-01), Hamburgen
patent: 4860444 (1989-08-01), Herrell et al.
patent: 4954774 (1990-09-01), Binet
patent: 5021924 (1991-06-01), Kieda et al.
patent: 5054192 (1991-10-01), Cray et al.
patent: 5102343 (1992-04-01), Knight et al.
patent: 5198752 (1993-03-01), Miyata et al.
patent: 5198753 (1993-03-01), Hamburgen
patent: 5476211 (1995-12-01), Khandros
patent: 5550482 (1996-08-01), Sano
patent: 5568054 (1996-10-01), Iino et al.
patent: 5650914 (1997-07-01), DiStefano et al.
patent: 5690749 (1997-11-01), Lee
patent: 5719444 (1998-02-01), Tilton et al.
patent: 5834946 (1998-11-01), Albrow et al.
patent: 5854092 (1998-12-01), Root et al.
patent: 5917707 (1999-06-01), Khandros et al.
patent: 5986447 (1999-11-01), Hanners et al.
patent: 6012224 (2000-01-01), DiStefano et al.
patent: 6033935 (2000-03-01), Dozier, II et al.
patent: 6056627 (2000-05-01), Mizuta
patent: 6064213 (2000-05-01), Khandros et al.
patent: 6078500 (2000-06-01), Beaman et al.
patent: 6085831 (2000-07-01), DiGiacomo et al.
patent: 6110823 (2000-08-01), Eldridge et al.
patent: 6140616 (2000-10-01), Andberg
patent: 6169409 (2001-01-01), Amemiya
patent: 6184053 (2001-02-01), Eldridge et al.
patent: 6184065 (2001-02-01), Smith et al.
patent: 6232149 (2001-05-01), Dozier, II et al.
patent: 6255126 (2001-07-01), Mathieu et al.
patent: 6268015 (2001-07-01), Mathieu et al.
patent: 6313652 (2001-11-01), Maeng
patent: 6451709 (2002-09-01), Hembree
patent: 6459581 (2002-10-01), Newton et al.
patent: 6468098 (2002-10-01), Eldridge
patent: 6534856 (2003-03-01), Dozier et al.
patent: 6550263 (2003-04-01), Patel et al.
patent: 6727580 (2004-04-01), Eldridge et al.
patent: 2002/0004320 (2002-01-01), Pedersen et al.
patent: 2002/0172007 (2002-11-01), Pautsch
patent: 0 261 829 (1988-03-01), None
patent: 403139899 (1991-06-01), None
patent: WO 95/14314 (1995-05-01), None
patent: WO 96/17378 (1996-06-01), None
patent: WO 98/52224 (1998-11-01), None
patent: WO 00/33089 (2000-06-01), None
patent: WO 01/131130 (2001-02-01), None
“Cooling System For Semiconductor Modules,” IBM Technical Disclosure Bulletin, vol. 26, No. 3B (Aug. 1983), p. 1548.
Advanced Electronic Packaging—With Emphasis on Multichip Modules, edited by William D. Brown, “13.5 Competitive Mainframe Packaging Examples,” pp. 547-550, Institute of Electrical and Electronics Engineers (1999).
Electronic Packaging and Interconnection Handbook, Editor-in Chief by Charles A. Harper, “2.7 High Heat-Load Cooling,” pp. 2.57-2.66, Third Edition (2000), McGraw-Hill.

Affiliated with

Also associated with

Rating

Electronic package with direct cooling of active electronic... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Electronic package with direct cooling of active electronic..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Electronic package with direct cooling of active electronic... will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3665842