Electronic package structure and method of making same

Details Electronic package structure and method of making same Electronic package structure and method of making same

1993-11-16

1994-11-22

Picard, Leo P.

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

361743, 361784, 361792, 174263, 257686, 257779, H05K 100

Patent

active

053674359

ABSTRACT:
An electronic package and method of making same wherein a flexible circuitized substrate is used to interconnect contact sites on a semiconductor device (chip) to respective conductors on a circuitized substrate (PCB). Significantly, the flexible substrate is coupled to the PCB using solder elements which are applied to the flexible substrate prior to semiconductor device coupling to others of the flexible substrates' conductive elements. These other conductive elements are then connected to the devices' contact sites using thermocompression bonding, the bonding occurring through an aperture in the flexible substrate.

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Surface Mount Technology, "Plastic Encapsulated Tape Automated Bonded Package", Feb. 1985, pp. 158-159.

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