Electronic package repair process

Details Electronic package repair process Electronic package repair process

2007-11-13

2007-11-13

Estrada, Michelle (Department: 2823)

Active solid-state devices (e.g., transistors, solid-state diode

With means to control surface effects

Insulating coating

C257S650000, C257S776000, C257SE23118, C257SE23192, C257SE21271, C257SE21273

Reexamination Certificate

active

11099161

ABSTRACT:
A multilayer ceramic repair process which provides a new electrical repair path to connect top surface vias. The repair path is established between a defective net and a redundant repair net contained within the multilayer ceramic substrate. The defective net and the repair net each terminate at surface vias of the substrate. A laser is used to form post fired circuitry on and in the substrate. This is followed by the electrical isolation of the defective net from the electrical repair structure and passivation of the electrical repair line.

REFERENCES:
patent: 4680615 (1987-07-01), Gotzenbrucker et al.
patent: 4911796 (1990-03-01), Reed
patent: 5073180 (1991-12-01), Farooq et al.
patent: 5493076 (1996-02-01), Levite et al.
patent: 5552607 (1996-09-01), Salisbury et al.
patent: 5655213 (1997-08-01), Natarajan et al.
patent: 5710460 (1998-01-01), Leidy et al.
patent: 5757079 (1998-05-01), McAllister et al.
patent: 5948192 (1999-09-01), Ikuina et al.
patent: 6262390 (2001-07-01), Goland et al.
patent: 6270601 (2001-08-01), Ritland et al.
patent: 6316116 (2001-11-01), Nakamura et al.
patent: 6335077 (2002-01-01), Tani et al.
patent: 6427324 (2002-08-01), Franklin et al.
patent: 6713686 (2004-03-01), Becker et al.
patent: 2003/0136581 (2003-07-01), Becker et al.

Affiliated with

Also associated with

Rating

Electronic package repair process does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Electronic package repair process, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Electronic package repair process will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3835299