Electronic package repair process

Details Electronic package repair process Electronic package repair process

2005-07-12

2005-07-12

Coleman, W. David (Department: 2823)

Semiconductor device manufacturing: process

Repair or restoration

Reexamination Certificate

active

06916670

ABSTRACT:
A multilayer ceramic repair process which provides a new electrical repair path to connect top surface vias. The repair path is established between a defective net and a redundant repair net contained within the multilayer ceramic substrate. The defective net and the repair net each terminate at surface vias of the substrate. A laser is used to form post fired circuitry on and in the substrate. This is followed by the electrical isolation of the defective net from the electrical repair structure and passivation of the electrical repair line.

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