Electronic package including lower water content polyimide film

Details Electronic package including lower water content polyimide film Electronic package including lower water content polyimide film

1991-05-06

1995-10-24

Picard, Leo P.

Electricity: conductors and insulators

Conduits, cables or conductors

Preformed panel circuit arrangement

174256, H05K 100

Patent

active

054612039

ABSTRACT:
The adhesion of chromium-copper layer to polyimide has been greatly improved by a method which provides controlled reduction, rather than total elimination, of water content in the polyimide. The electronic packaging device which incorporates the flexible circuit prepared by the method exhibits greatly improved reliability. It is believed that the invention can be used to improve the adhesion between other organic materials having moisture affinity and materials comprising in-organics or between two organic materials.

REFERENCES:
patent: 3984907 (1976-10-01), Vossen, Jr. et al.
patent: 4331526 (1982-05-01), Kuehnle
patent: 4517051 (1984-05-01), Gazdik et al.
patent: 4544571 (1985-10-01), Miller
patent: 4725504 (1988-02-01), Knudsen et al.
patent: 4842946 (1989-06-01), Foust et al.
patent: 4863808 (1989-09-01), Sallo
patent: 5019210 (1991-05-01), Chou et al.
Society of Vacuum Coaters, 33rd Annual Technical Conference Proceedings (1990) pp. 205-211, "Plated Cu Line Thickness Effects on Peel Test Values", by Chen et al.
Society of Vacuum Coaters, 33rd Annual Technical Conference, Apr. 29-May 4, 1990, (7 pages), "DC Glow Effects on Web Temperatures", by Blackwell et al.
Society of Vacuum Coaters, 34th Annual Technical Conference, Mar. 17-22, 1991, "Web Temperature Profiles and Thermal Resistance Modeling of Roll Sputtering Copper and Chromium onto Polyimide Webs", (6 pages), by Blackwell et al.
Society of Vacuum Coaters, 34th Annual Techinical Conference, Mar. 17-22, 1991, "Data Acquistion and Control of a Roll Sputter System", (5 pages), by Blackwell et al.
IBM Technical Disclosure Bulletin, vol. 32, No. 3B, Aug., 1989, pp. 235-236, "Use of Plasma Modification to Increase Polymer Adhesion to Oxygen Etch Barriers", by Anderson et al.
IBM Technical Disclosure Bulletin, vol. 30, No. 7, Dec. 1987, pp. 227-228, "Super Adhesive Bonding of Metal to Polyimide", by Efros et al.
Journal of Adhesion Science and Technolology, vol. 3, No. 6, pp. 441-453 (1989), "Effects of Environment and Heat Treatment on an Oxygen Plasma-Treated Polyimide Surface and its Adhesion to a Chromium Overcoat", by Knoll et al.

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