Electronic package having stress buffer layer on mounting...

Details Electronic package having stress buffer layer on mounting... Electronic package having stress buffer layer on mounting...

2011-04-12

2011-04-12

SanMartin, J. (Department: 2837)

Electrical generator or motor structure

Non-dynamoelectric

Piezoelectric elements and devices

C310S344000, C310S348000

Reexamination Certificate

active

07923904

ABSTRACT:
An electronic component capable of withstanding stress from a printed circuit board or the like is provided. In an electronic component, a cavity hermetically sealed by a base and a lid is formed. In the cavity, a crystal resonator is supported by a supporting member over the top surface of the base. The base is made of glass. A stress buffer layer made of a conductive resin or the like is formed over the whole bottom surface of the base. An external electrode and an external electrode that are in continuity with the electrodes of the crystal resonator individually extend to the bottom surface of the stress buffer layer via the side surfaces of the base and stress buffer layer. The thus configured electronic component is surface-mounted by, for example, soldering the external electrode and external electrode formed on the bottom surface of the stress buffer layer to a printed circuit board.

REFERENCES:
patent: 6204454 (2001-03-01), Gotoh et al.
patent: 6541897 (2003-04-01), Endoh
patent: 6960870 (2005-11-01), Kikushima et al.
patent: 7002282 (2006-02-01), Mishima
patent: 7675224 (2010-03-01), Tanaya
patent: 2007/0252482 (2007-11-01), Sakai
patent: 2007/0278903 (2007-12-01), Yamamoto
patent: 2009/0224634 (2009-09-01), Murakami et al.
patent: 07-154183 (1995-06-01), None
patent: 07-212159 (1995-08-01), None
patent: 2002-289735 (2002-10-01), None
patent: 2007-129327 (2007-05-01), None
International Search Report for International Application No. PCT/JP2009/052184, dated Apr. 7, 2009, 2 pages.

Affiliated with

Also associated with

Rating

Electronic package having stress buffer layer on mounting... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Electronic package having stress buffer layer on mounting..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Electronic package having stress buffer layer on mounting... will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-2655837