Electronic package having controlled height stand-off solder...

Details Electronic package having controlled height stand-off solder... Electronic package having controlled height stand-off solder...

2006-01-17

2006-01-17

Cooke, Colleen P. (Department: 1754)

Metal fusion bonding

Process

Plural joints

C228S246000, C228S248100, C228S248500, C257S795000, C438S025000, C438S106000

Reexamination Certificate

active

06986454

ABSTRACT:
An electronic package (10) is provided which includes a circuit board (12) having a substrate (14) and circuitry (16) and a surface mount device (22) having a contact terminal (24). A mounting pad (28) is formed on the circuit board (12). The electronic package (10) also includes a solder joint (30) connecting the contact terminal (24) of the surface mount device (22) to the mounting pad (28) on the circuit board (12). The solder joint (30) includes a reflowable solder and a plurality of stand-off members (32or42). The stand-off members (32or42) provide a separation distance (H) between the circuit board (12) and surface mount device (22) in the range of about 0.01 mm to 0.10 mm.

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patent: 11-026910 (1999-01-01), None

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