Electronic package having a folded flexible substrate and...

Details Electronic package having a folded flexible substrate and... Electronic package having a folded flexible substrate and...

2006-12-12

2006-12-12

Thai, Luan (Department: 2891)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Insulative housing or support

C438S106000, C438S125000, C438S127000

Reexamination Certificate

active

07148087

ABSTRACT:
An electronic package is provided and its method of construction. A microelectronic die is mounted to a flexible substrate. A mold cap is injection-molded over the die. The mold cap has a curved convex edge surface around which the flexible substrate wraps. Folding of the flexible substrate is controlled by the edge surface to reduce defects, ensure consistent form factor from one package to the next, and allow for the inclusion of a relatively resilient ground plane.

REFERENCES:
patent: 6300679 (2001-10-01), Mukerji et al.
patent: 6323060 (2001-11-01), Isaak
patent: 6351029 (2002-02-01), Isaak
patent: 2001/0006252 (2001-07-01), Kim et al.
patent: 2001/0040793 (2001-11-01), Inaba
patent: 2003/0020153 (2003-01-01), Bruce et al.
patent: 2004/0104470 (2004-06-01), Bang et al.
patent: PCT/US2004/030993 (2004-09-01), None

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