Electronic package having a folded flexible substrate and...

Details Electronic package having a folded flexible substrate and... Electronic package having a folded flexible substrate and...

2005-12-06

2005-12-06

Thai, Luan (Department: 2891)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

Multiple housings

C257S723000, C257S724000, C257S725000

Reexamination Certificate

active

06972482

ABSTRACT:
An electronic package is provided and its method of construction. A microelectronic die is mounted to a flexible substrate. A mold cap is injection-molded over the die. The mold cap has a curved convex edge surface around which the flexible substrate wraps. Folding of the flexible substrate is controlled by the edge surface to reduce defects, ensure consistent form factor from one package to the next, and allow for the inclusion of a relatively resilient ground plane.

REFERENCES:
patent: 5345205 (1994-09-01), Kornrumpf
patent: 6225688 (2001-05-01), Kim et al.
patent: 6300679 (2001-10-01), Mukerji et al.
patent: 6351029 (2002-02-01), Isaak
patent: 2001/0006252 (2001-07-01), Young et al.
patent: 2001/0040793 (2001-11-01), Tetsuya
patent: 2003/0020153 (2003-01-01), Ted et al.
patent: 2004/0104470 (2004-06-01), Bang et al.
patent: PCT/US2004/030993 (2004-09-01), None

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