Electronic package formed using low-temperature active...

Details Electronic package formed using low-temperature active... Electronic package formed using low-temperature active...

2005-05-04

2010-10-05

Ip, Sikyin (Department: 1793)

Metal treatment

Stock

C420S555000, C420S557000, C420S562000

Reexamination Certificate

active

07806994

ABSTRACT:
An active solder alloy, an electronic device package including the active solder alloy bonding an electronic device to a substrate, and a method of forming high-strength joints by soldering using the solder alloy. The alloy contains up to about 10% by weight of an element or a mixture of elements selected from the group consisting of titanium, zirconium, hafnium, vanadium, niobium, or tantalum; between about 0.1 and 5% by weight of an element or a mixture of elements selected from the group of the lanthanides (rare earths); between about 0.01 and 1% by weight of gallium up to about 10% by weight of silver; up to about 2% by weight of magnesium; and a remainder consisting of tin, bismuth, indium, cadmium, or a mixture of two or more of these elements. The alloy enables low-temperature (less than about 180° C.) soldering within relatively narrow melting ranges (less than about 10° C.).

REFERENCES:
patent: 3949118 (1976-04-01), Nagano et al.
patent: 4040822 (1977-08-01), Stern
patent: 4106930 (1978-08-01), Nomaki et al.
patent: 4451541 (1984-05-01), Beal
patent: 4643875 (1987-02-01), Mizuhara
patent: 4785989 (1988-11-01), Mizuhara et al.
patent: 4797328 (1989-01-01), Boehm et al.
patent: 5011511 (1991-04-01), Beck
patent: 5184399 (1993-02-01), Ueno et al.
patent: 5286441 (1994-02-01), Shibata
patent: 5372298 (1994-12-01), Glaeser
patent: 5435857 (1995-07-01), Han et al.
patent: 5447683 (1995-09-01), Montgomery et al.
patent: 5527628 (1996-06-01), Anderson et al.
patent: 5598966 (1997-02-01), Romano et al.
patent: 5690890 (1997-11-01), Kawashima et al.
patent: 5695861 (1997-12-01), Bloom
patent: 5851482 (1998-12-01), Kim
patent: 6047876 (2000-04-01), Smith
patent: 6231693 (2001-05-01), Lugscheider et al.
patent: 6319617 (2001-11-01), Jin et al.
patent: 6367683 (2002-04-01), Rass et al.
patent: 7041180 (2006-05-01), Lugscheider et al.
patent: 193612 (1957-11-01), None
patent: 809 972 (1951-08-01), None
patent: 1 128 672 (1962-04-01), None
patent: 2 235 376 (1974-02-01), None
patent: 195 26 822 (1997-01-01), None
patent: 199 53 670 (2001-05-01), None
patent: 0 235 546 (1987-09-01), None
patent: 0 652 072 (1995-05-01), None
patent: 1 357 073 (1974-06-01), None
patent: 1 385 191 (1975-02-01), None
patent: 57127596 (1982-08-01), None
patent: 59116350 (1984-07-01), None
patent: 60135550 (1985-07-01), None
patent: 03128192 (1991-05-01), None
patent: 03294449 (1991-12-01), None
patent: WO 97/03789 (1997-02-01), None
patent: WO 99/02299 (1999-01-01), None
patent: 0134860 (2001-05-01), None
Humpston, Giles et al., Principles of Soldering and Brazing, 1993, ASM International, pp. 38, 52, 53, 66, 67 and 167.
A.P. Xian, “Precursor film in a metal-ceramic wetting system,” Welding In The World, vol. 30, No. 9/10, Sep. 1, 1992, pp. 243-251.
Soldering Manual, American Welding Society, Inc., selected pages (2nded. 1977).
Kapoor et al., “Tin-Based Reactive Solders for Ceramic/Metal Joints,” Metallurgical Transactions B, vol. 20B, pp. 919-924 (Dec. 1989).
Hayduk, Jr., “Effect of Atmosphere Composition on Metallizing AI2O3Substrates with Mo-Mn Paste,” Reprinted from Solid State Technology (Apr. 1985).
J. Intrater, “Review of Some Processes for Ceramic-To-Metal Joining,” Materials & Manufacturing Processes, 8(3), pp. 353-373 (1993).
Baudrand, “Electroless Nickel Plating On Metallized Ceramic,” Reprinted from Plating Finishing (Sep. 1981).
“Standard Specification for Metalized Surfaces on Ceramic,” Annual Book of ASTM Standards, Part II, (Reapproved 1978).
Brazing Handbook, American Welding Society, Inc., pp. 411-422 (4thed. 1991).

Affiliated with

Also associated with

Rating

Electronic package formed using low-temperature active... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Electronic package formed using low-temperature active..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Electronic package formed using low-temperature active... will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-4198559