Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Assembly of plural semiconductive substrates each possessing...
Reexamination Certificate
2008-06-10
2008-06-10
Geyer, Scott B. (Department: 2812)
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
Assembly of plural semiconductive substrates each possessing...
C257SE21509
Reexamination Certificate
active
07384818
ABSTRACT:
A semiconductor device package and method for its fabrication are provided. The semiconductor device package generally includes at least one semiconductor die and a substrate coupled to the semiconductor die. The semiconductor die is provided with a front side defining a sealing area, and a first solder sealing ring pad formed on that front side. The substrate is provided with a front surface opposing the front side of the semiconductor die on which a second solder sealing ring pad is formed. A solder sealing ring structure is sandwiched between the first and second solder sealing pads of the substrate and semiconductor die, such that it extends peripherally about a substantial portion of the sealing area to substantially enclose thereat a cavity between the semiconductor die and the substrate. The solder sealing ring structure includes at least one venting portion defining against at least one of the substrate and semiconductor die an air vent in open communication with the cavity.
REFERENCES:
patent: 6297072 (2001-10-01), Tilmans et al.
patent: 6600217 (2003-07-01), Onodera et al.
patent: 7259032 (2007-08-01), Murata et al.
patent: 2003/0210531 (2003-11-01), Alcoe et al.
Kim Deok-Hoon
Lee Hwan-Chul
Geyer Scott B.
Optopac, Inc.
Rosenberg , Klein & Lee
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