Electronic package device, module, and electronic apparatus

Details Electronic package device, module, and electronic apparatus Electronic package device, module, and electronic apparatus

2007-02-28

2010-10-12

Clark, S. V (Department: 2823)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

Insulating material

C257S784000

Reexamination Certificate

active

07812440

ABSTRACT:
There is provided an electronic device package and the like in which it is not likely that damage occurs in a wiring pattern of an interposer substrate in a gap section formed, for example, between an electronic device and an insertion substrate. The semiconductor package in accordance with the present invention is a package of fan-out type including an interposer substrate and a semiconductor device and an insertion substrate which are arranged on the substrate. The interposer substrate3includes a wiring pattern therein. A gap is formed between the semiconductor device and the insertion substrate; in an area corresponding to the gap, a reinforcing member (a metallic film7) is formed to increase strength of the wiring pattern.

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