Electronic package cooling system and heat sink with heat transf

Metal working – Method of mechanical manufacture – Heat exchanger or boiler making

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Details

29447, 29890036, 257713, 257722, 361687, 361697, 361718, 165 803, B23P 1500

Patent

active

058159215

ABSTRACT:
A method for minimizing thermal overhead in an integrated circuit package is described. A heat sink having a base is integrally formed into the package. The base is connected to the die, and a portion of the heat sink projects from the package, forming a post. A heat transfer assembly having a shaft with an aperture is heated until the aperture expands sufficiently to allow the heat transfer assembly to be fitted on the post with a minimum of force. Upon cooling, a tight joint is formed between the heat sink and the heat transfer assembly.

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