Electronic package comprising aluminum nitride and aluminum nitr

Details Electronic package comprising aluminum nitride and aluminum nitr Electronic package comprising aluminum nitride and aluminum nitr

1990-09-27

1992-04-07

Ryan, Patrick J.

Stock material or miscellaneous articles

Composite

Of inorganic material

174250, 428901, 501 96, 501 97, 501 98, 501152, B32B 900, B32B 1700

Patent

active

051027496

ABSTRACT:
An electronic package comprising dielectric layers including a densified aluminum nitride (AlN) base layer and at least one densified AlN-borosilicate glass composite layer bonded thereto is described. Any of the dielectric layers may be metallized with conductive circuit patterns and can contain conductive vias. Production of this package is accomplished by hot pressing a greenware laminate comprising a densified base (e.g., AlN); at least one green sinterable sheet(e.g., AlN-borosilicate glass composite); and a green sheet of non-sinterable material (e.g., boron nitride [BN]. The respective green sheets comprise homogeneous mixtures of the ceramic powders and a binder, e.g., polyethylene. The polyethylene is burnt off during the hot press operation. Residual BN is removed by brushing and/or grit blasting, leaving the finished electronic package, all ceramic elements of which are densified. The package provides superior thermal conductivity, strength, dielectric properties, and silicon-compatibility.

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patent: 4435513 (1984-03-01), Komeya et al.
patent: 4591357 (1986-05-01), Aldinger et al.
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patent: 4882212 (1989-11-01), Singhdeo et al.
patent: 4927711 (1990-05-01), Francis et al.
patent: 4948759 (1990-08-01), Nair

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