Electronic package comprising aluminum nitride and aluminum nitr

Details Electronic package comprising aluminum nitride and aluminum nitr Electronic package comprising aluminum nitride and aluminum nitr

1990-08-01

1991-12-17

Dixon, Jr., William R.

Compositions: ceramic

Ceramic compositions

Refractory

501 19, 501 20, 501 66, 427154, 156344, 264 61, 428427, 428432, 428689, C04B 3558

Patent

active

050735268

ABSTRACT:
An electronic package comprising dielectric layers including a densified aluminum nitride (AlN) base layer and at least one densified AlN-borosilicate glass composite layer bonded thereto is described. Any of the dielectric layers may be metallized with conductive circuit patterns and can contain conductive vias. Production of this package is accomplished by hot pressing a greenware laminate comprising a densified base (e.g., AlN); at least one green sinterable sheet (e.g., AlN-borosilicate glass composite); and a green sheet of non-sinterable material (e.g., boron nitride [BN]). The respective green sheets comprise homogeneous mixtures of the ceramic powders and a binder, e.g., polyethylene. The polyethylene is burnt off during the hot press operation. Residual BN is removed by brushing and/or grit blasting, leaving the finished electronic package, all ceramic elements of which are densified. The package provides superior thermal conductivity, strength, dielectric properties, and silicon-compatibility.

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