Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Patent
1996-08-01
1998-11-17
Picard, Leo P.
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
361760, 174 35R, 174 35GC, 257699, 257723, 257728, H05K 900
Patent
active
058385517
ABSTRACT:
Electronic package with an electronic component mounted upon a PCB or ceramic substrate by first level interconnects and housing second level interconnects on the other side of the PCB. The component is protected by an EMI shield which is grounded to a ground plane of the PCB. Especially significant when there are a plurality of components protected by the shield and when at least one of the components is an integrated circuit component (I.C.C.). The package is thus prebuilt with the EMI shield and without a separate package required for each I.C.C., and is robust in construction for shipping. The shield and ground plane provide a Faraday cage which is especially complete when the shield extends around edges of the PCB and onto its other side. The package is ready for connection to a motherboard by use of the second level interconnects and process steps to place EMI shields individually onto mother boards are avoided.
REFERENCES:
patent: 5355016 (1994-10-01), Swirbel et al.
patent: 5400949 (1995-03-01), Hirvonen et al.
patent: 5422433 (1995-06-01), Rivera et al.
patent: 5530202 (1996-06-01), Dais et al.
Austin R. J.
Gandhi Jayprakash N.
Northern Telecom Limited
Picard Leo P.
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