Electronic package assembly with protective encapsulant material

Details Electronic package assembly with protective encapsulant material Electronic package assembly with protective encapsulant material

1994-06-01

1995-11-21

Sparks, Donald A.

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

22818021, 257790, 257730, 361760, 361783, 437211, 174 521, 174259, 174260, 174 522, 174 523, 174 524, H05K 706, H01L 2158, H01L 2328

Patent

active

054693330

ABSTRACT:
An electronic package assembly wherein a low profile package is soldered to an organic (e.g., epoxy resin) substrate (e.g., printed circuit board). The assembly's projecting conductive leads are soldered. An encapsulant material (e.g., polymer resin) is used to provide reinforcement for the solder-lead connections, the encapsulant material being dispensed only along opposing sides of the package's housing which do not include projecting leads (and which are oriented substantially normal to the stresses imposed on the package during operation wherein high temperatures are attained). This dispensing may follow solder reflow and solidification. The invention is particularly useful with thin, small outline package (TSOP) structures which occupy a minimum of height on the substrate surface.

REFERENCES:
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patent: 5317106 (1994-05-01), Kwon
IBM Technical Disclosure Bulletin "Encapsulated Solder Joint For Chip Mounting" vol. 32 No. 10B Mar. 1990.
IBM Technical Disclosure Bulletin vol. 33, No. 10B, Mar. 1991, pp. 205-207, "Encapsulation Schemes For C4-Bonded Tab Packages", by Ameen et al.
"The Effects Of Thermal Cycle Stress On Potted SMT Circuit Card Assemblies", by R. M. Berg (date and journal unknown).

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