Electronic package assembly with capillary bridging connection

Details Electronic package assembly with capillary bridging connection Electronic package assembly with capillary bridging connection

1975-01-13

1976-01-27

Clay, Darrell L.

Metal working

Method of mechanical manufacture

Electrical device making

174 52FP, 174 685, 317101CP, 29588, H05K 310, H05K 330

Patent

active

039343367

ABSTRACT:
An electronic package assembly comprising a substrate having a central recess in which a semiconductor chip can be mounted. A narrow inclined groove is cut into the edge of the recess and extends from the recess bottom to the location of a screen-printed ground lead on the surface of the substrate. Conductive paste is painted on the bottom of the recess for attachment of a chip and a portion of the paste is drawn up the groove by capillary action to form a tenacious bond with the screen-printed ground lead.

REFERENCES:
patent: 3316458 (1967-04-01), Jenny
patent: 3728469 (1973-04-01), Rybarczk
patent: 3760090 (1973-09-01), Fowler

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