Electronic package assembly method

Details Electronic package assembly method Electronic package assembly method

1979-01-10

1980-11-04

Husar, Francis S.

Metal working

Method of mechanical manufacture

Electrical device making

29842, 29847, 357 75, 357 80, H05K 306, H05K 310, H05K 334

Patent

active

042311543

ABSTRACT:
A method for making an electronic package assembly of the type having an insulator pin carrier, a thin, i.e. substantially five microns, flexible printed circuit (PC) polyimide member having printed circuit conductors bonded to the heads of the pins of the carrier, and one or more integrated circuit (IC) chips with a high density (i.e. 100 or more) input/output I/O terminal array on the bottom surface of each chip bonded to a corresponding registerable array of PC conductor pads of the polyimide member. The forming, curing and circuitizing of the polyimide member, the bonding of the I/O terminals to the pads of the PC member, and the bonding of the pin heads to the PC member are done on a temporary support or fixture. The method provides a reliable manner for fabrication of the package assembly which minimizes the risk of destroying the flexibility of the PC member and/or its integrity during the making of the assembly and/or the subsequent thermal cycling associated with the assembly.

REFERENCES:
patent: 3387365 (1968-06-01), Stelmak
patent: 3488840 (1970-01-01), Hymes et al.
patent: 3777220 (1973-12-01), Tatusko et al.
patent: 3868724 (1975-02-01), Perrino
patent: 4074342 (1978-02-01), Honn et al.
Solid State Tech., Nov. 1969, pp. 31ff, Art by Cannizzaro.
Electronics, Feb. 16, 1970, pp. 116ff, Art. by Grurninger.
IBM Tech. Discl. Bull., vol. 17, No. 7, Dec. 1974, pp. 2018ff, by Liv et al.
IBM Tech. Discl. Bull., vol. 20, No. 8, Jan. 1978, pp. 3020ff, by Abolafia et al.

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