Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – For plural devices
Patent
1994-03-25
1995-11-21
Mintel, William
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
For plural devices
257724, 257726, 257727, H01L 2334
Patent
active
054689961
ABSTRACT:
An electronic package including a base member and associated cover member designed for being positioned together to compress at least two circuitized substrates (e.g., a ceramic substrate and a plurality of flexible substrates) positioned therein. One of the substrates is substantially rigid and is positively positioned in a protected, aligned manner within the base. Additionally, the flexible substrates are precisely aligned and initially secured to the rigid substrate, the invention further using yet another resilient means to act against each of the flexible substrates when the packages are fully assembled. The cover is secured to the base to effect final compression of the internal elements. This package may be positioned on and electrically coupled to another circuitized substrate, e.g., PCB.
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Chan Benson
Chapin Fletcher L.
Fiacco Vincent M.
Mankus John R.
Pokrzywa Robert S.
Fraley Lawrence R.
International Business Machines - Corporation
Mintel William
Potter Roy
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