Electronic package assembly

Details Electronic package assembly Electronic package assembly

2005-01-11

2005-01-11

Thai, Luan (Department: 2827)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

For plural devices

C257S724000, C257S779000, C257S782000, C257S698000

Reexamination Certificate

active

06841869

ABSTRACT:
An electronic package assembly includes a number of semiconductor devices with first and second sides. A printed circuit substrate has a number of printed circuit patterns bonded to conductive pads of the first sides of the devices. A metal leadframe includes leads which provide external connections for the package assembly, and also includes a non-lead island portion bonded to conductive pads of the second sides of the devices. In this way the island portion of the leadframe forms an interconnection between the second sides of the devices.

REFERENCES:
patent: 3972062 (1976-07-01), Hopp
patent: 4965710 (1990-10-01), Pelly et al.
patent: 5532512 (1996-07-01), Fillion et al.
patent: 6324072 (2001-11-01), Lorenz et al.
patent: 3531235 (1986-04-01), None
patent: 9603224 (1997-07-01), None

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