Electronic package and semiconductor device using the same

Details Electronic package and semiconductor device using the same Electronic package and semiconductor device using the same

2007-09-25

2007-09-25

Purvis, Sue A. (Department: 2826)

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

With structure for mounting semiconductor chip to lead frame

C257SE23043

Reexamination Certificate

active

11168934

ABSTRACT:
A package for an electronic component according to one embodiment of the invention has a chip mounting area mounting a semiconductor chip in a hollow part of a metal plate and a plurality of connection electrodes to be connected to a substrate. The plurality of connection electrodes are formed in opposite sides of the rectangular metal plate and arranged asymmetrically with respect to a perpendicular bisector of the opposite sides.

REFERENCES:
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patent: 6633077 (2003-10-01), Ogata et al.
patent: 6787392 (2004-09-01), Quah
patent: 6891256 (2005-05-01), Joshi et al.
patent: 2004/0201081 (2004-10-01), Joshi et al.
patent: 2004/0207054 (2004-10-01), Brown et al.
patent: 2004/0212053 (2004-10-01), Koh et al.
patent: 2005/0133893 (2005-06-01), Joshi et al.
patent: 2004-40008 (2004-02-01), None

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