Electronic package and packaging method

Details Electronic package and packaging method Electronic package and packaging method

2007-10-30

2007-10-30

Ngo, Hung V. (Department: 2831)

Electricity: conductors and insulators

Boxes and housings

With electrical device

C361S782000, C361S790000

Reexamination Certificate

active

11338624

ABSTRACT:
A first substrate includes a coil assembly and an integrated circuit mounted thereon. A second substrate includes capacitors 16 and resistors mounted thereon. The first substrate and the second substrate are interconnected by an encapsulating medium. A conductive via is provided to electrically connect the first substrate and the second substrate together

REFERENCES:
patent: 5777381 (1998-07-01), Nishida
patent: 6317324 (2001-11-01), Chen et al.
patent: 6784530 (2004-08-01), Sugaya et al.
patent: 2004/0160752 (2004-08-01), Yamashita et al.
patent: H11-163583 (1999-06-01), None
patent: H11-237860 (1999-08-01), None
Definition of inductor, answer.com, printed Jan. 16, 2007, p. 1-10.

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