Electronic package and method of making same

Details Electronic package and method of making same Electronic package and method of making same

1992-07-06

1994-01-11

Thompson, Gregory D.

Electricity: electrical systems and devices

Safety and protection of systems and devices

Arc suppression at switching point

174254, 439 67, 361717, H05K 720

Patent

active

052787249

ABSTRACT:
An electronic package and method of making same wherein the package includes a first substrate (e.g., printed circuit board), a second, flexible circuitized substrate (e.g., polyimide dielectric with conductors thereon) having a semiconductor device (chip) electrically coupled thereto. The outer portions of the flexible circuitized substrate are wrapped about the frame which in turn includes portions thereof which serve to spacedly position the wrapped flexible substrate with respect to the first substrate such that conductors on both substrates may be precisely aligned and electrically coupled in a permanent manner. A method of assembling the invention, including the use of a vacuum head and appropriate heat thermodes, is also defined.

REFERENCES:
patent: 3825803 (1974-07-01), Budde
patent: 4495546 (1985-01-01), Nakamura et al.
patent: 4547834 (1985-10-01), Dumont et al.
patent: 4550357 (1985-10-01), Mutsumoto
patent: 4628408 (1986-12-01), Kimura
patent: 4691972 (1987-09-01), Gordon
patent: 4824379 (1989-04-01), Roberts et al.
patent: 4843520 (1989-06-01), Nakatani et al.
patent: 4859189 (1989-08-01), Petersen et al.
patent: 4885126 (1989-12-01), Polonio
patent: 4886461 (1989-12-01), Smith
patent: 4996585 (1991-02-01), Gruber et al.
patent: 5018005 (1991-05-01), Lin et al.
Franck et al., "Microcircuit Module And Connector", IBM Tech. Discl. Bulletin, vol. 13, No. 7, Dec. 1970, pp. 1786-1787.

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