Electronic package and method of forming

Details Electronic package and method of forming Electronic package and method of forming

2005-08-23

2005-08-23

Andújar, Leonardo (Department: 2826)

Active solid-state devices (e.g., transistors, solid-state diode

Encapsulated

With heat sink embedded in encapsulant

C257S707000, C257S713000, C257S720000

Reexamination Certificate

active

06933619

ABSTRACT:
An electronic package and method of making same in which a thermally conductive member is in thermally conductive communication with a semiconductor chip encapsulated within a dielectric material that surrounds portions of a thermally conductive member, semiconductor chip, and a predefined portion of a circuitized substrate. The present invention's thermally conductive member includes two portions of different bending stiffness to assure reduced interfacial stresses between the semiconductor chip and the circuitized substrate.

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“Process Considerations in the Fabrication of Teflon Printed Circuit Boards”, by Light et al, 1994 Proceedings, 44 Electronic Components and Technology Conference, May 1994.

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