Electronic package and method of cooling electronics

Details Electronic package and method of cooling electronics Electronic package and method of cooling electronics

2007-12-11

2007-12-11

Thompson, Gregory (Department: 2835)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

C165S080400, C257S706000, C257S712000, C257S714000, C361S717000, C361S719000, C361S722000

Reexamination Certificate

active

11191822

ABSTRACT:
An electronic package having circulated submersed cooling fluid and method are provided. The electronic package has a housing defining a sealed enclosure and electronic devices located in the housing. The electronic devices have thermal emitting electrical circuitry. A dielectric fluid, such as a liquid, is located in the housing in heat transfer relationship with the electronic devices. A fluid circulator, such as a piezo fan, is located in the housing in contact with the dielectric liquid for circulating the dielectric liquid to cool the electronic devices.

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http://www.temperatures.com/bimel.html,Bimetallic Thermometers and Thermostats, “How Thermometers Work” by Marshall Brain, ©1998-2007 HowStuffWorks, Inc., 5 pages.
http://www.piezo.com/prodfan1vac.html, 115VAC/60Hz Piezo Fan Blade, Piezo Systems, Inc., Catalog #7, 2006, cover page and p. 12.
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