Electronic package and method for testing the same

Details Electronic package and method for testing the same Electronic package and method for testing the same

2007-06-07

2008-08-05

Nguyen, Vincent Q (Department: 2831)

Electricity: measuring and testing

Fault detecting in electric circuits and of electric components

For fault location

C324S076110, C714S735000

Reexamination Certificate

active

07408362

ABSTRACT:
An integrated circuit package includes at least two electronic circuits. A first of the at least two electronic circuits includes a digital input and a digital output and a test mode control line for setting the first integrated circuit chip into a determined test mode. The digital input includes at least two parallel input paths and the digital output includes at least two parallel output paths. The at least two parallel input paths and at least two parallel output paths provide a corresponding number of internal paths by which the first electronic circuit and a second electronic circuit can be tested essentially simultaneously.

REFERENCES:
patent: 4241307 (1980-12-01), Hong
patent: 6492798 (2002-12-01), Sunter
patent: 2002/0053056 (2002-05-01), Kuegler et al.
patent: 2004/0006752 (2004-01-01), Whetsel
patent: 2004/0181729 (2004-09-01), Whetsel
patent: 0430128 (1991-06-01), None
patent: 0273821 (1994-10-01), None

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