Electronic package and method

Details Electronic package and method Electronic package and method

1996-02-06

1998-07-28

Gellner, Michael L.

Electrical resistors

With heat dissipating projections

257706, 174 163, 361690, 361715, 361763, 361773, 338273, 338276, 338275, 338 53, H01C 108

Patent

active

057867453

ABSTRACT:
A package (10) has outermost surfaces (12, 13, 14, 16) that form a polygon shape. The body (11) of the package (10) has axial symmetry about an axis (21). A lead (22) exits the package along the axis (21).

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Translation of Tane et al. (JP 3-233747).
Translation of Breitfleder (DE 245685).
General Instrument,Power Semiconductor Division, Data Book 11th Edition, Jan. 1994, p. 3 and p. 368.

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