Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Reexamination Certificate
2000-07-12
2001-11-20
Gaffin, Jeffrey (Department: 2841)
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
C361S734000, C361S738000, C361S777000, C361S780000, C361S782000, C361S783000, C257S691000, C257S724000, C257S784000, C257S786000
Reexamination Certificate
active
06320757
ABSTRACT:
BACKGROUND OF THE INVENTION
1. Field of the Invention
This invention generally relates to an electronic package, and more particularly to an electronic package using wire bonding technique wherein the electronic package comprises a chip disposed on a substrate having a ground ring, a power ring, and at least a surfacemountable device connected across the ground ring and the power ring.
2. Description of the Related Art
An electronic package typically includes a circuitized substrate with one or more active devices attached thereon; packages including only one device are known as Single Chip Modules (SCM), while packages including a plurality of devices are called Multi Chip Modules (MCM). The active device is typically a chip commonly made of Silicon, Germanium or Gallium Arsenide.
As the speed of semiconductor devices increase, noise in the DC power and ground lines increasingly becomes a problem. To reduce this noise, capacitors known as decoupling capacitors are often used to reduce power supply noise which occurs due to change in potential difference between the ground voltage and the power-supply voltage supplied to the active device. The decoupling capacitors are placed as close to the active device as practical to increase their effectiveness. Typically the decoupling capacitors are connected to power and ground as close as possible to the active device.
FIG. 1
shows a conventional BGA substrate
100
with a chip
110
securely attached to the metal paddle
102
on the upper surface of the substrate
100
. The upper surface of the substrate
100
is provided with a ground ring
104
, a power ring
106
, and a plurality of conductive traces
108
. The ground ring
104
is predetermined for coupling to a source of the ground reference voltage. The power ring
106
is predetermined for coupling to a source of the power reference voltage potential. In order to suppress the power supply noise described above, several decoupling capacitors
120
are connected across the ground ring
104
and the power ring
106
. Typically, the decoupling capacitors
120
are surface-mountable devices (SMD's) used in the so-called surface-mounting technique in which the capacitors
120
are directly secured to the ground ring
104
and the power ring
106
via two end contacts thereof.
However, when these capacitors are on the substrate at the package level, they hinder the space available for the wire bonding. This is because it is generally preferred to avoid contact between the bonding wires and the capacitors. Therefore, the bonding wires
130
connected between the chip
110
and the ground ring
104
(or the power ring
106
) at the periphery of the decoupling capacitors
120
must keep away from the decoupling capacitors
120
thereby increasing difficulties and risks of wire bonding.
SUMMARY OF THE INVENTION
It is a primary object of the present invention to provide an electronic package comprising a chip disposed on a substrate having a ground ring, a power ring, and at least a surface-mountable device connected across the ground ring and the power ring, wherein the electronic package is characterized in that the surface-mountable device has at least a bonding region formed on one end contact thereof for bonding to a bonding wire thereby allowing the chip to be electrically connected to the ground ring or power ring directly through the end contact of the surface-mountable device.
The electronic package according to a preferred embodiment of the present invention mainly comprises a chip disposed on the upper surface of a substrate. The upper surface of the substrate is provided with a ground ring, a power ring, and a plurality of conductive traces arranged at the periphery of the ground ring and the power ring. The electronic package comprises at least a surface-mountable device (such as a decoupling capacitor) connected across the ground ring and the power ring. The surface-mountable device comprises two end contacts and at least a bonding region formed on one of the end contacts. The electronic package comprises at least a bonding wire having one end connected to one of the bonding pads of the chip and the other end connected to the bonding region of the surface-mountable device such that the chip can be electrically connected to the ground ring or power ring directly through the end contact of the surface-mountable device. Since the bonding wires predetermined to be connected between the chip and the ground ring (or the power ring) at the periphery of the surface-mountable device don't have to keep away from the surfacemountable device, difficulties and risks of wire bonding for the electronic package of the present invention are significantly reduced.
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Advanced Semiconductor Engineering Inc.
Gaffin Jeffrey
Vigushin John B.
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