1989-07-18
1991-02-26
James, Andrew J.
357 80, G11C 504, H01L 2302
Patent
active
049965859
ABSTRACT:
An electronic package (11) which comprises a substrate (12) having several chips (13) arranged thereon, and a plurality of connector pins (26) fitted in pin plates (21-24) and electrically connected via conductors to the chips (13). Each pin plate is mounted by means of at least one flexible connector element (29) connected to the conductors at a respective peripheral section (16-19) of the substrate (12). The pin plates have a base surface in the form of any discretionary polygon, in such a manner that, when folded, form a plane substantially flush with the plane of the substrate (12) into a position beneath the substrate (12), or vice versa. Thus an electronic package is obtained which is less complex in its manufacture and covers a considerably reduced base surface while offering a comparable performance.
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Gruber Harald
Hinrichsmeyer Kurt
Horbach Heinz G.
Stadler Ewald E.
Bardales Norman R.
Fraley Lawrence R.
International Business Machines - Corporation
James Andrew J.
Nguyen Viet Q.
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