Electronic package

Details Electronic package Electronic package

1991-06-24

1994-08-09

Picard, Leo P.

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

174255, 361792, 361793, 361795, 439 47, 439 44, 439 45, H05K 111

Patent

active

053372190

ABSTRACT:
A method for altering an electrical connection in an electronic package including one or more semiconductor chips overlying, i.e., mounted directly onto, or mounted onto one or more modules which are mounted onto, a substrate such as a printed circuit card or printed circuit board, as well as the resulting electronic package, is disclosed. In accordance with a preferred embodiment of the inventive method, at least one plated, solder-filled hole in the substrate is drilled out to eliminate an unwanted electrical connection. A solder region, e.g., a solder ball, is inserted into the drilled out hole into contact with an electrically conductive member, e.g., an electrically conductive pin, extending from, for example, a module into the hole. A cylinder, including a central core of electrically conductive material, encircled by an annulus of electrically insulating material, is inserted into the hole. The solder region is then reflowed to form an electrical and metallurgical bond between the module member and the central core. A new electrical connection is completed by extending a wire bond from the bottom of the central core to the bottom of the central core in another such hole or to the bottom of a solder-filled hole.

REFERENCES:
patent: 3487530 (1970-01-01), Ely
patent: 5067007 (1991-11-01), Kanji et al.
IBM Disclosure Bulletin "Module Socket Pins with Insulating Sleeves" by Higgins and Shabe vol. 22 No. 7 Dec. 1979.
IBM Disclosure Bulletin "Insulated Pin for Printed Circuit Cards With Feed-Through Holes" vol. 29 No. 3 Aug. 1986.
IBM TDB "Defective Hole Repair/Hermetic Seal", vol. 23, No. 9 Feb. 1981, F. H. Sarnacki.
IBM TDB, "Backfill System for PCB Rework", vol. 23, No. 11, p. 4883, M. J. Reynolds.
IBM TDB, "Defective Hole Repair", vol. 22, No. 1, pp. 67-68 F. H. Sarnacki.
IBM TDB, "Defective Via Repair", vol. 24, No. 5, p. 2572 Oct. 1981, R. E. Darrow.
IBM TDB, "Cast-Solder Preloading For Stacked Modules", vol. 20 No. 2, pp. 545-546, Jul. 1977, D. L. Rivenburgh.
IBM TDB, "Robotic Hot Air Solder/Desolder Placement Device", vol. 30, No. 1, pp. 114-116, Jun. 1987.
IBM TDB, "Component Rework With Low-Melt Alloy Solder", vol. 21, No. 12, p. 4790, May 1979.

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