Electronic or opto-electronic packages

Coherent light generators – Particular temperature control – Heat sink

Reexamination Certificate

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Details

C372S031000, C372S109000

Reexamination Certificate

active

06920162

ABSTRACT:
An electronic device such as a laser diode is mounted on a heatsink assembly within a TO-can package. The heatsink assembly is mounted in heat exchange relation with a heat pipe by being on or adjacent a heat pipe. The heat pipe is either attached to an exterior face of the TO-can package or passes into the TO-can package to efficiently draw heat away from the heatsink assembly.

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EPO Abstract of Japanese Patent 2001044554, Publication Date Feb. 16, 2001.
EPO Abstract of Japanese Patent 08242041, Publication Date Sep. 17, 1996.

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