Electronic module with stacked semiconductors

Active solid-state devices (e.g. – transistors – solid-state diode – Regenerative type switching device

Reexamination Certificate

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C257S686000, C257S401000, C257S288000, C327S409000

Reexamination Certificate

active

11348221

ABSTRACT:
An electronic module has a heat sink with an upper surface and a lower surface, a plurality of leads arranged adjacent the heat sink and at least one circuit element with two vertical semiconductor power switches. The two vertical semiconductor power switches of each circuit element are arranged in a stack and are configured to provide a half-bridge circuit having a node defining an output. The first vertical semiconductor power switch of each of the circuit elements is mounted on the upper surface of the heat sink by an electrically conductive layer such that the lower surface of the heat sink provides the ground contact area of the electronic module.

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Welch et al. (Jun. 2005). Transient Liquid Phase (TLP) Bonding for Microsystem Packaging Applications. Symposium conducted at the 13th International Conference on Solid-State Sensors, Acutators, and Microsystems, Seoul, Korea.
Mohan, Ned. First Course on Power Electronics and Drives. Minneapolis: MNPERE, 2003.

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