Electronic module with low impedance ground connection using fle

Details Electronic module with low impedance ground connection using fle Electronic module with low impedance ground connection using fle

1996-06-17

1998-01-13

Picard, Leo P.

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

361753, 361799, 361818, 174 35R, 174 51, 174254, 439 95, H05K 702, H05K 714, H05K 900, H05K 100

Patent

active

057085684

ABSTRACT:
An electronic module, particularly an electromagnetic interference module includes an assembly for providing a low impedance ground path for at least one electrical component on a printed circuit board of the module. A chassis of the module is employed as a ground source. The printed circuit board is a rigid flex printed circuit board constructed of multiple circuit layers including flexible and rigid circuit layers. The board has at least one rigid portion with both flexible and rigid circuit layers and at least one flexible portion constructed of at least one flexible circuit layer. An electrical component to be grounded is located on a rigid portion of the board. A flexible circuit layer of the rigid flex printed circuit board is used as a return making a direct ground path from the rigid flex printed circuit board to the chassis for grounding the electrical component.

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