Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package
Reexamination Certificate
2005-09-06
2005-09-06
Pham, Hoai (Department: 2814)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
C257S734000, C257S735000, C257S736000
Reexamination Certificate
active
06940156
ABSTRACT:
An electronic module contains a semiconductor chip that has flexible chip contacts. The flexible chip contacts are disposed on an uppermost metallization layer and have a dimensionally stable contact plate which is connected to contact surfaces on the uppermost metallization layer via electrically conductive components in an elastomeric embedding compound.
REFERENCES:
patent: 5891366 (1999-04-01), Gruenwald et al.
patent: 6133072 (2000-10-01), Fjelstad
patent: 2004/0164411 (2004-08-01), Shin et al.
patent: 2004/0262742 (2004-12-01), DiStefano et al.
patent: 195 17 062 (1996-01-01), None
patent: 100 49 397 (2001-10-01), None
patent: 5062981 (1993-03-01), None
Bauer Michael
Birzer Christian
Ofner Gerald
Stoeckl Stephan
Greenberg Laurence A.
Ha Nathan W.
Infineon - Technologies AG
Locher Ralph E.
Pham Hoai
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