Electronic module, panel having electronic modules which are...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings

Reexamination Certificate

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Details

C257S777000, C257S784000

Reexamination Certificate

active

10934549

ABSTRACT:
The invention relates to an electronic module having electronic components, which are arranged in vertically staggered component layers, which are electrically conductively connected to one another via regions, which are uncovered within the respective component layers, of contact bumps or of bonding connections and via interconnects, which are arranged between the component layers and are connected to the uncovered regions. Moreover, the invention relates to a process for producing the electronic module, either in a panel or as individual components.

REFERENCES:
patent: 5877550 (1999-03-01), Suzuki
patent: 6211461 (2001-04-01), Park et al.
patent: 6222259 (2001-04-01), Park et al.
patent: 0 729 183 (1996-08-01), None
patent: 0 920 058 (1999-06-01), None
patent: 1 030 369 (2000-08-01), None

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