Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings
Reexamination Certificate
2007-10-02
2007-10-02
Pham, Hoai (Department: 2814)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
Multiple housings
C257S777000, C257S784000
Reexamination Certificate
active
10934549
ABSTRACT:
The invention relates to an electronic module having electronic components, which are arranged in vertically staggered component layers, which are electrically conductively connected to one another via regions, which are uncovered within the respective component layers, of contact bumps or of bonding connections and via interconnects, which are arranged between the component layers and are connected to the uncovered regions. Moreover, the invention relates to a process for producing the electronic module, either in a panel or as individual components.
REFERENCES:
patent: 5877550 (1999-03-01), Suzuki
patent: 6211461 (2001-04-01), Park et al.
patent: 6222259 (2001-04-01), Park et al.
patent: 0 729 183 (1996-08-01), None
patent: 0 920 058 (1999-06-01), None
patent: 1 030 369 (2000-08-01), None
Bauer Michael
Eurskens Wolfram
Gruendler Gerold
Kerler Rudolf
Pape Heinz
Edell Shapiro & Finnan LLC
Infineon - Technologies AG
Nguyen DiLinh
Pham Hoai
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